佛山市瑞欧检测技术服务有限公司
指令
欧盟议会及欧盟会于2003年2月13日在其《公报》上发布了《废旧电子电气设备指令》（简称《weee指令》）和《电子电气设备中限制使用某些有害物质指令》（简称《rohs指令》）
《rohs指令》和《weee指令》规定纳入有害物质限制管理和报废回收管理的有十大类102种产品，前七类产品都是我国主要的出口电器产品。包括大型家用电器、小型家用电器、信息和通讯设备、消费类产品、照明设备、电器电子工具、玩具、休闲和运动设备、医用设备（被植入或被感染的产品除外）、监测和控制仪器、自动售卖机。
2008年12月3日，欧盟发布了weee指令（2002/96/ec）和rohs指令（2002/95/ec）的修订提案。本次提案的目的是创造更好的法规环境，即简单、易懂、有效和可执行的法规。rohs指令修订的主要内容有：
1. 改变了法律用词，澄清了指令的范围和定义；
2. 引入产品的ce标志以及ec合格声明；
3. 分阶段将医疗器械、控制和监控仪器纳入到rohs指令的范畴；
限制的六种有害物质没有变化，但四种物质——邻苯二甲酸二异丁酯(dibp)、邻苯二甲酸（2-乙基己基酯）（dehp）、邻苯二甲酸丁苄酯（bbp）和邻苯二甲酸二丁酯（dbp）——要求进行优先评估，以便考察将来是否纳入限制物质的范畴
rohs范围：
仅对于2006年7月1日起投放市场的新产品。
包括家用的白炽灯和光源。
不应违反特殊的关于安全和健康要求的专门指令或规定——vehicle elv，汽车指令；电池指令，91/157/eec,93/86/eec&98/101/ec
不包括：医用器材或监控设备（weee指令第8，9类）；在2006年7月1日前投放市场的维修备件；2006年7月1日前原先投放市场的再利用产品。
限制的有毒物质：
·重金属:
–lead铅;
–mercury汞;
–cadmium镉;
–chromium (vi)六价铬.
本指令将在发布于oj第20日起生效，成员国需要在2013年1月2日前将其转化为本国法律。
2011/65/eu的发布将给中国的电子电气产品制造企业带来一定的影响，特别是由于将医疗器械类产品、监视和控制仪器产品列入规管的范围，因此对这两类制造企业的影响将是非常巨大的
此外，由于电子电气产品上需要贴附ce标志，因此，对业界符合指令的要求，也将是一个巨大的挑战。
rohs 2.0新增产品类别
2011年11月30日，欧盟会宣布，已开始对2011/65/eu指令（rohs 2.0指令）的影响评估研究结果的工作。欧盟会计划通过研究扩展rohs 2.0指令的范围，将原先排除在rohs 1.0指令之外的产品和产品类别包含其中，并据此提出新提案。根据新研究，新指令附件1.0中包含的产品范围将扩大，通过未来的研究和公众咨询还可能进一步扩大。但在迄今会发布的产品范围草案中，已包含了需引起出口商极大关注的产品。
豁免项
简述
由于技术问题，部分材料或者产品的制造技术还做不到rohs指令要求，在经过向欧盟的特殊申请后，以下项目可以获得豁免（部分豁免是有期限的）：
rohs exemptionseu rohs
items exemption clauses
原有
1 mercury in compact fluorescent lamps not exceeding 5 mg per lamp
2 mercury in straight fluorescent lamps for general purposes not exceeding:
- halophosphate 10 mg
- triphosphate with normal lifetime 5 mg
- triphosphate with long lifetime 8 mg.
3 mercury in straight fluorescent lamps for special purposes.
4 mercury in other lamps not specifically mentioned in this annex.
5 lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
6 lead as an alloying element in steel containing up to 0.35% lead by weight, aluminium containing up to 0.4% lead by weight and as a copper alloy containing up to 4% lead by weight.
7 - lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
- lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications
- lead in electronic ceramic parts (e.g. piezoelectronic devices).
8 cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under directive 91/338/eec (1) amending directive 76/769/eec (2) relating to restrictions on the marketing and use of certain dangerous substances and preparations
9 hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption refrigerators.
10 lead used in compliant pin connector systems
11 lead as a coating material for the thermal conduction module c-ring
12 lead and cadmium in optical and filter glass
13 lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80% and less than 85% by weight
14 lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages
15 decabde in polymeric applications
16 lead in lead-bronze bearing shells and bulbs
17 lead in linear incandescent lamps with silicate coated tubes
18 lead halide as radiant agent in high intensity discharge (hid) lamps used for professional reprography applications
19 lead as activator in the fluorescent powder (1% lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as bsp (basi2o5:pb) as well as when used as specially lamps for diazo-printing reprography, lithography, insect traps, photochemical and curing processes containing phosphors such as sms ((sr,ba)2mgsi2o7:pb)
20 lead with pbbisn-hg and pbinsn-hg in specific compositions as main amalgam and with pbsn-hg as auxiliary amalgam in very compact energy saving lamps (esl)
21 lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps used for liquid crystal displays (lcd)
22 lead and cadmium in printing inks for the application of enamels on borosilicate glass.
23 lead as impurity in rig (rare earth iron gamet) faraday rotators used for fibre optic communication systems.
24 lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with nife lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65mm or less with coppler lead frames.
25 lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors.
26 lead oxide in plasma display panels (pdp) and surface conduction electron emitter displays (sed) used in structural elements, notably in the front and rare glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes.
27 lead oxide in the glass envelope of black light blue (blb) lamps.
28 lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 db spl and above) loudspeakers.
29 hexavalent chromium in corrosion preventive coatings of unpainted metal sheetings and fasterners used for corrosion protection and electromagnetic interference shielding in equipment falling under category three of directive 2002/96/ec (it and telecommunications equipment). exemption granted until 1 july 2007.
30lead bound in crystal glass as defined in annex i (category 1,2,3 and 4) of council directive 69/493/eec
新增
2009年6月11日，欧盟oj刊登了2009/443/ec，新增了6项rohs指令的豁免，分别如下：
33. lead insolders for the soldering of thin copper wires of 100 μm diameter andless in power transformers. 电力变压器中直径100微米及以下细铜线所用焊料中的铅
34. lead in cermet-based trimmer potentiometer elements. 金属陶瓷质的微调电位计中的铅
6月5，欧盟刊登了2009/428/ec，从2011年1月1日起，将原豁免的第22点“光纤通讯系统稀土铁石榴石法拉第旋转器中作为杂质的铅”从豁免列表中移除。
“从化rohs认证权威性高”联系方式 佛山市瑞欧检测技术服务有限公司 张新华（经理）
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